In a significant move, TSMC, Bosch, Infineon, and NXP announced the establishment of European Semiconductor Manufacturing Company (ESMC) GmbH in Dresden, Germany. This strategic collaboration aims to elevate semiconductor manufacturing services in Europe, focusing on the automotive and industrial sectors.
- Fab Advancements: ESMC plans to construct a 300mm fab to meet the future capacity needs of industries. The fab is anticipated to have a monthly production capacity of 40,000 300mm wafers, incorporating TSMC’s advanced process technology.
- Innovation Hub: The joint venture, led by TSMC with 70% ownership, symbolizes a pivotal moment for Europe’s semiconductor ecosystem. It aligns with the European Chips Act framework, fostering innovation and creating high-tech jobs.
- Strategic Stakeholders: Bosch, Infineon, and NXP each hold a 10% equity stake, subject to regulatory approvals. The total investment is expected to exceed 10 billion euros, supported by the European Union and the German government.
- Operational Timeline: Construction is set to begin in H2 2024, with production slated for the end of 2027. The venture not only addresses immediate capacity needs but also positions Europe as a hub for advanced semiconductor technologies.
- Leadership Insights: Dr. CC Wei (TSMC), Dr. Stefan Hartung (Bosch), Jochen Hanebeck (Infineon), and Kurt Sievers (NXP) express excitement about deepening partnerships and recognizing Europe’s potential for semiconductor innovation.
Conclusion: ESMC marks a transformative step in shaping the future of European semiconductor manufacturing. Watch for updates as TSMC, Bosch, Infineon, and NXP collaborate to redefine the continent’s role in advanced semiconductor technologies.