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APCSM 2022: Effectiveness of Sampling Frequency Reduction in the Wafer Manufacturing using Machine Learning based Virtual Metrology

October 12, 2022

Smart Manufacturing (SM), Industry 4.0, and traditional APC capabilities all require the availability of relevant information in real time to optimize manufacturing operations. The implementation of these capabilities presents a number of challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The microelectronics industry poses somewhat unique challenges in its SM migration arising from the industry’s complex, high-precision and highly dynamic production environment. Despite these obstacles, SM capabilities are already being realized in microelectronics manufacturing in key areas such as predictive analytics and the digital twin. The world’s most advanced factories are implementing Industrial Internet of Things (IIoT), supply chain optimization and big data solutions to reduce cost, improve quality, and shorten cycle time. Semiconductor, memory, photovoltaic, display, MEMS, LED, pharmaceuticals, chemical and many other industries are experiencing unparalleled cost and quality pressures. These demanding objectives have made APC-enabled Smart Manufacturing absolutely critical for profitable manufacturing.

In this presentation, Lynceus and NXP Semiconductors worked together on a case study to determine whether a reduction in the physical measurement frequency of metrology equipment could be achieved without impacting the quality of virtual metrology predictions.

To download this presentation, click here: https://go.lynceus.ai/APCSM_2022

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